s y s t e m c e r t i f i c a t i o n i s o 9 0 0 1 description designed and manufactured in the usa, the cx9v quartz crystal is available in frequencies from 32 khz to 160 khz. using micro-machining processes, this surface-mountable crystal is hermetically sealed within a ultra-miniature ceramic package to ensure high stability and low aging. t ight calibration and high frequency/temperature stability make the cx9v ideally suited for all low frequency applications. fea tures ultra-miniature, surface mount design (4.1mm x 1.5mm) low profile (typically 0.80mm) a vailable with glass or ceramic lid hermetically sealed ceramic package high shock and vibration survival excellent aging characteristics designed for low power applications full military testing available designed and manufactured in the usa applica tions medical pacemaker , defibrillator , and other implantables medical instruments industrial, computer , & communications smart card down hole instrumentation t ransponder / animal migration process instrumentation military & aerospace airborne hybrid navigational computer real time clock c x 9 v s m c r y s t a l 3 2 k h z t o 1 6 0 k h z ultra-miniature, low profile surface mount quartz crystal 10157 - rev a c 0 c 1 r 1 2 1 l 1 equiv alent circuit r 1 motional resistance l 1 motional inductance c 1 motional capacitance c 0 shunt capacitance rsg electronic components gmbh - sprendlinger landstr. 115 - 63069 offenbach - germany - www.rsg-electronic.de typ . max. dim inches mm inches mm a 0.160 4.10 0.170 4.32 b 0.060 1.50 0.068 1.73 c - - see below d 0.031 0.79 0.038 0.97 dim ? glass lid ceramic lid max inches mm inches mm sm1 0.035 0.89 0.038 0.97 sm2 0.036 0.91 0.039 0.99 sm3 0.037 0.94 0.040 1.02 top bottom b a c d p ackage dimensions actual size suggested land p a ttern 0.084[2.10] 0.080 [2.10] grid courty ard 0.048[1.30] 0.132[3.40] 0.180[4.70] inches[mm] side view glass lid shown
rsg electronic components gmbh - sprendlinger landstr. 115 - 63069 offenbach - germany - www.rsg-electronic.de s y s t e m c e r t i f i c a t i o n i s o 9 0 0 1 10157 - rev a termina tions d e s i g n a t i o n t e r m i n a t i o n s m 1 g o l d p l a t e d s m 2 n i c k e l , s o l d e r p l a t e d s m 3 n i c k e l , s o l d e r d i p p e d specifica tions specifications are typical at 25 o c unless otherwise noted. specifications are subject to change without notice. 32.768 khz 100 khz m o t i o n a l r e s i s t a n c e r 1 ( k ? ) 70 19 m o t i o n a l c a p a c i t a n c e c 1 ( f f ) 2.2 1.0 quality factor q (k) 27 80 shunt capacitance c 0 (pf) 1.1 0.84 load capacitance (pf)* 9 5 t urning point ( o c)** 20 16 standard calibration t olerance*** glass lid: 30 ppm, 100 ppm, 1000 ppm ceramic lid: 100 ppm, 1000 ppm, 10000 ppm drive level 0.5 w max t emperature coef ficient (k) -0.035 ppm/ o c 2 aging, first year 5 ppm shock, survival 5,000 g peak, 0.3 ms, 1/2 sine v ibration, survival 20 g rms, 10-2,000 hz random operating t emp. range -10 o c to +70 o c (commercial) -40 o c to +85 o c (industrial) -55 o c to +125 o c (military) storage t emp. range -55 o c to +125 o c max process t emperature 260 o c for 20 sec. note: deviation in frequency (f) @ temperature (t) from frequency (f o ) @ turning point temperature (t o ); * other load capacitance values available ** other temperatures available *** tighter tolerances available + _ + _ + _ + _ + _ + _ f-f o = k (t -t o ) 2 f o how to order cx9vsm cryst als s c sm1 100.0k, 100 / m c = ceramic lid blank = glass lid amplifier buffer c g c d r a cx9 osc freq (f ) o r f conventional cmos pierce oscilla tor circuit ??if special or custom design. blank if std. cx9v p ackaging options cx9vsm -t ray pack -16mm tape, 7?or 13?reels per eia 481 (see data sheet 10109) sm1 = gold plated sm2 = nickel, solder plated sm3 = nickel, solder dipped frequency k = khz calibration t olerance @ 25 o c (in ppm) operating t emp. range: c = -10 o c to +70 o c i = -40 o c to +85 o c m = -55 o c to +125 o c s = customer specified
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